Substrate Wetting Additives

Improved surface wetting for smooth film formation on challenging substrates.
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What We Solve

Poor substrate wetting can lead to cratering, pinholes, and uneven film formation — especially on low surface energy substrates or contaminated surfaces. JebChem Substrate Wetting Additives are designed to improve wetting performance, ensuring smoother films and better surface coverage in coatings and inks.

  • Water-borne systems
  • Solvent-borne systems
  • Printing inks
  • Overprint varnish (OPV) systems

Our portfolio includes both silicone and silicone-free technologies, offering tailored solutions for static and dynamic wetting requirements. Products with enhanced dynamic wetting are ideal for high-speed printing applications, while static wetting options support uniform film formation in coating systems. Silicone-free grades also offer low-foam or defoaming characteristics, supporting stable processing performance.

Why JebChem?

  • Enhanced wetting on low energy substrates

  • Static and dynamic wetting options available

  • Silicone and silicone-free technologies

  • Low-foam and defoaming grades available

  • RCIC-backed technical support

Need detailed specifications and system compatibility data? 

Download the technical catalogue for product options, key features, and recommended applications.

View Catalogue (PDF)
Request Technical Support / Samples

JebChem Technical Reports

Application-focused studies and performance evaluations from our RCIC team.