Substrate Wetting Additives

Improved surface wetting for smooth film formation on challenging substrates.
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What We Solve

Poor substrate wetting can lead to cratering, pinholes, and uneven film formation — especially on low surface energy substrates or contaminated surfaces. JebChem Substrate Wetting Additives are designed to improve wetting performance, ensuring smoother films and better surface coverage in coatings and inks.

  • Water-borne systems
  • Solvent-borne systems
  • Printing inks
  • Overprint varnish (OPV) systems

Our portfolio includes both silicone and silicone-free technologies, offering tailored solutions for static and dynamic wetting requirements. Products with enhanced dynamic wetting are ideal for high-speed printing applications, while static wetting options support uniform film formation in coating systems. Silicone-free grades also offer low-foam or defoaming characteristics, supporting stable processing performance.

Why JebChem?

  • Enhanced wetting on low energy substrates

  • Static and dynamic wetting options available

  • Silicone and silicone-free technologies

  • Low-foam and defoaming grades available

  • RCIC-backed technical support

Need detailed specifications and system compatibility data? 

Download the technical catalogue for product options, key features, and recommended applications.

View Catalogue (PDF)
Request Technical Support / Samples

JebChem Technical Reports

Application-focused studies and performance evaluations from our RCIC team.

Introducing JebChem Matting Agents

Introducing JebChem Matting Agents

Our matting agents provide excellent properties for all coatings related technologies, including industrial applications such as coil and wood coatings , printing inks and decorative coatings.